Summary: Etched one wafer for a target depth of 48.54 microns. Measurements were done on the P10 profilometer 2. Pre Etch Measurement: Resist thickness at 2.6 mic...
Summary: We achieved a depth of around 44 microns in the measured images. (Target depth 48.56 microns). We achieved widths around 4.4 microns less than the mask w...
Summary: 3 test wafers, one optical quality wafer intended for use with mask_102813. Spin: * Wafer Preparation: Vapor Prime YES Oven * Resist used: SPR 220 ...
Summary: Etched one test wafer for a target depth of 48.54 microns. Measurements were done on the P10 Profilometer 2. Pre Etch Measurement: Resist thickness at 2....
Summary: Etched optical wafer for a target depth of 48.54 microns. Measurements were done on the P10 Profilometer 2. Pre Etch Measurement: Resist thickness at 2.8...
Optical wafer from 11/12/13 was cut using the all purpose blade on the silicon dicing saw. Attached are annotated pictures taken of polished samples, from each wi...
Summary: Etched one optical wafer for a target depth of 48.54 microns. Measurements were done on the P10 Profilometer 2. Pre Etch Measurement: Resist thickness at...