BoEs - Cost Basis of Estimates (NSF Scope)

• 402.0.3 PM - Project Office (NSF) [Doc DB - 12793]
• 402.0.5 PM - Common Fund Contribution (NSF) [Doc DB - 12887]
• 402.3.2 BC - Management [Doc DB - 13805]
• 402.3.3.2 EB - Frontend and Optical Links [Doc DB - 12843]
• 402.3.3.3 EB - Off Detector Electronics [Doc DB - 12844]
• 402.3.3.4 EB - Trigger Concentrator Cards [Doc DB - 12845]
• 402.3.3.5 EB - Clock and Control System [Doc DB - 12846]
• 402.3.3.6 EB - Full Prototype [Doc DB - 12847]
• 402.3.4.4 HB - Backend Electronics [Doc DB - 12851]
• 402.3.4.5 HB - Full Prototype [Doc DB - 12982]
• 402.5.2 EM - Management [Doc DB - 12853]
• 402.5.3.1 EM - CSC Electronics - ODMB Boards [Doc DB - 12987]
• 402.5.3.2 EM - CSC Electronics - FED Systems [Doc DB - 12988]
• 402.5.4.1 EM - GEM - GE2_1 Electronics [Doc DB - 13018]
• 402.5.4.2 EM - GEM - ME0 Electronics [Doc DB - 13019]
• 402.7.2 FP - Management [Doc DB - 12812]
• 402.7.3.1 FP - Sensors [Doc DB - 13068]
• 402.7.3.2 FP - Readout Chips [Doc DB - 13069]
• 402.7.3.3 FP - Sensor-ROC Assembly [Doc DB - 13070]
• 402.7.4.1 FP - Module Factories [Doc DB - 13071]
• 402.7.4.2 FP - Module Assembly [Doc DB - 13072]
• 402.7.4.3 FP - Module Testing and Calibration [Doc DB - 13073]
• 402.7.5.1 FP - Portcards [Doc DB - 13075]
• 402.7.5.2 FP - Interconnects [Doc DB - 13076]
• 402.7.5.3 FP - Power and Detector Control Systems [Doc DB - 13077]
• 402.7.5.4 FP - Data Acquisition Systems [Doc DB - 13078]
• 402.7.5.5 FP - Electronics Test Setups [Doc DB - 13079]
• 402.7.6.1 FP - Mechanics Components [Doc DB - 13080]
• 402.7.6.2 FP - Services [Doc DB - 13081]
• 402.7.6.3 FP - Assembly and Testing [Doc DB - 13083]
• 402.7.6.4 FP - Shipping to CERN and Reassembly [Doc DB - 13084]
• 402.9.2 TD - Management (NSF) [Doc DB - 13769]
• 402.9.4 TD - Muon Trigger [Doc DB - 13106]
• 402.9.7 TD - Track Trigger [Doc DB - 13167]