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"Development of thin silicon sensors for tracking "

This project aims at establishing the feasibility of using thin silicon sensors for tracking at the ILC. Our R&D wil answer the following questions: Can thin detectors be manufactured with a reasonable yield? What signal to noise ratio and resolution can be obtained with thin sensors? Can mechanical handling and mechanical support challenges be met?

We have already manufactured in silicon strip sensors in the following thicknesses: 150, 200, and 300 microns in 4 inch technology. The sensors were manufactured using the masks developed for the silicon layer mounted on the CDF beam pipe. We have measured the DC characteristics of the sensors such as leakage current, interstrip resitastance and interstrip capacitance. We are currently evaluating the S/N with the the SVX 4 readout chip. In the next few years we expect to start studies of the mechanical mounting and the stability of thin silicon strips. There are several ladder designs that are under discussion with the SiD community.

We are receiving minimal support for this project and we struggling to achieve the critical mass necessary to carry out these studies.

Please address the following questions in your statement.

  • What are the goals of this R&D project. How does this R&D project address the needs of one or more of the detector concepts?

  • If there are multiple institutions participating in this project, please describe the distribution of responsibilities.

  • Are there significant recent results?

  • What are the plans for the near future(about 1 year)? What are the plans on a time scale of 2 to 3 years?

  • Are there critical items that must be addressed before significant results can be obtained from this project?

  • Is the support for this project sufficient? Are there significant improvements that could be made with additional support?